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X-ray image sensor

E-mail contact

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With the CCD with a CsI type FOS (FOP with X-ray scintillator), the FOP functions as a shield, so X-ray damage on the CCD can be suppressed. In addition to FOS, FOP coupling is also possible. Note that products that employ GOS for the scintillator are also available as low cost types.
The TDI -CCD S7199-01 and S8658-01 can provide crosssectional X-ray imaging of large objects through TDI operation. It can be used not only in X-ray radiography equipment but also for industrial inline non-destructive inspections.
The photodiode arrays with amplifiers that have a phosphor sheet affixed on the photosensitive area can be used in various types of inspection equipment such as inline industrial product inspection equipment and foreign matter inspection of canned and retort food.
 
 
X-ray image examples
 
taken with S10810-11    
   
taken with S8658-01   taken with S7199-01
 

 

CCD area image sensors for X-ray radiography

CCD image sensors with large photosensitive area and high resolution are used in X-ray radiography.

Type no.

Scintillator

Pixel size
[μm (H) × μm (V)]

Number of
effective pixels

Frame rate*1
(frames/s)

Photo

S8980

CsI
(+ FOP)

20 × 20

1500 × 1000

2

S10810-11

1

S10814

1700 × 1200

1

S10811-11

1 (max.)

S8984-02

Without
scintillator*2

1

*1: Area scanning
*2: Coupled with FOP
 
◎ CCD signal processing module
The C9266-03/-04 are signal processing circuits for X-ray CCD area image sensors. These allow easy operation by connecting to a PC.
The C9226-03 has a BNC connector for external trigger input.

Type no.

Signal frequency

Interface
effective pixels

Photo

S8984-02

1 MHz

USB 2.0

S8984-02

 

 

CMOS area image sensors for X-ray radiography
CMOS image sensors with large photosensitive area and high resolution are used in X-ray radiography.

Type no.

Scintillator

Pixel size
[μm (H) × μm (V)]

Number of
effective pixels

Frame rate
(frames/s)

Photo

S10830-12

CsI
(+ FOP)

20 × 20

1000 × 1500

0.9

S10834-12

S10831

1300 × 1700

0.6

S10835-12

 

 

 

TDI-CCD area image sensors

These CCDs are long and narrow type FFT-CCD area image sensors coupling FOS. CCD chips are linearly arranged in close proximity to form a long and narrow sensor format. They are used for X-ray radiography or non-destructive inspection.

Type no.

Scintillator

Pixel size
[μm (H) × μm (V)]

Number of
effective pixels

Frame rate*4
(frames/s)

Photo

S7199-01*3

CsI
(+ FOP)

48 × 48

1536 × 128
(2-chip buttable)

15

S8658-01*3

1536 × 128
(3-chip buttable)

*3: The types coupling FOP (S7199-01F, S8658-01F) are provided.
*4: Area scanning
 
Photodiode arrays with amplifier for non-destructive inspection
Photodiode arrays with amplifier having phosphor sheet affixed on the photosensitive area are allowed for non-destructive inspection

Type no.

Scintillator

Pixel height
(mm)

Pixel pitch
(mm)

Number of
pixels

Line rate
(lines/s)

Photo

S11865-64G

Phosphor
screen

0.8

0.8

64

14678

S11865-128G

0.6

0.4

128

7568

S11865-256G

0.3

0.2

256

3844

S11866-64G-02

1.6

1.6

64

14768

S11866-128G-02

0.8

0.8

128

7568

 

Driver circuits for photodiode arrays with amplifier

Type no.

Scintillator

Number of
effective pixels

Photo

C9118

Single power supply (+5 V) Operation with two input signals (M-CLK and M-RESET)

For single/parallel
connection

C9118-01

For serial
connection

 

 

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