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X-Ray Flat Panel Sensor

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HAMAMATSU has been a leading supplier of opto-semiconductor sensors of diverse types and ategories including sensors for high energy physics, UV sensors, visible light sensors, infrared sensors, position sensors, and linear or image sensors since 1957. Over the last 20 years, intense research and development have been made into various techniques for capturing X-ray images with solid state image sensors and some remarkable results have been achieved. Besides being ideal for digital imaging, solid state image sensors are expected to replace conventional image acquisition methods based on ortho film or imaging tubes. After years of laboratory development, HAMAMATSU has deemed digital X-ray imaging is ready. A unique flat panel sensor based on the single crystal CMOS technologies was developed in 1987. Then a prototype of CMOS flat panel sensor was fabricated in 1993. This sensor had a large pixel size and still retained an analog interface, but it was a milestone in the digital radiography field. The dedicated world’s first monolithic CMOS flat panel sensor with 12 cm photodiode array area was developed in 1999. The latest line-up of flat panel sensor still inherits the advantages of single crystal Si yet has expanded analog and digital performances achieved through CMOS technology and outstanding scintillator.

Application		Type No.	Scan mode	A/D (bits)	Pixel size ( μm)	Photodiode area [(H) × (V) mm]	Frame rate *1 (frames/s)	Scintillator	Energy range	Top cover material (thickness)	CE marking *2
Radiology	Rotational radiography	C10900D	Fast	13	200	124.8 × 124.8	35	Direct deposition CsI	20 kVp to 90 kVp	-	-
			Partial	13	200		70
			Fine	12	100		17
			Panoramic	12	100		280
		C9252DK-14	Whole	13	200	249.6 × 124.8	30			Carbon fiber (1.0 mm)	-
		C9252DK-14	Partial	12	100	249.6 × 124.8	146			Carbon fiber (1.0 mm)	-
	Biochemistry	C7942CK-22	-	12	50	120 × 120	2	CsI FSP	20 kVp to 80 kVp	Carbon fiber (1.0 mm)	○
		C9730DK-10	-	14		52.8 × 52.8	4	Direct deposition CsI	17 keV (Mo source)
		C9732DK-11	-	14		120 × 120	1	Direct deposition CsI	17 keV (Mo source)
	Diffraction	C9728DK-10	-	14	50	52.8 × 52.8	3	Direct deposition CsI	18 keV Max.	Carbon fiber (1.0 mm)	○
		C10158DK	Whole	14	50	118.8 × 118.8	3				-
		C10158DK	Partial	14	50	118.8 × 118.8	12				-
Non-destructive inspection (offline) *3	General X-ray	C7921CA-29	-	12	50	52.8 × 52.8	4	CsI FSP	20 kVp to 100 kVp	Aluminum (1.0 mm)	○
		C7942CA-22	-		50	120 × 120	2
		C7943CA-22	-		100	124.8 × 124.8	7
	High tube voltage	C7942SK-25	-	12	50	120 × 120	2	GOS-deposited FOP	20 kVp to 150 kVp	Carbon fiber (1.0 mm)	○
	High tube voltage	C9312SK-06	-	12	50	124.8 × 115.2	8	GOS-deposited FOP	20 kVp to 110 kVp	Carbon fiber (1.0 mm)	○

*1: Single operation

*2: Types marked with a circle ( ○ ) conform to the European EMC directives: EN61326-1 Class A.

*3: Not recommended for use in inline applications where large radiation damage may occur.

Note:

The HAMAMATSU flat panel sensor has not been legally approved for medical applications. This means that the flat panel sensor alone cannot be used as medical equipment. When incorporating the flat panel sensor in systems for medical applications, be sure to obtain any required legal approvals.

X-ray Image Sensor Technology

CMOS Process Technology

HAMAMATSU develops and manufactures unique flat panel sensors with large area, low noise and high resolution for X-ray imaging field.

The latest Si process line realizes the world largest monolithic CMOS chip where optimized high performance electronics are obtained. HAMAMATSU

can provide high-quality X-ray images for various X-ray imaging applications.

Scintillator Technology

HAMAMATSU has succeeded in developing an optimal and high-sensitivity X-ray device ideal for indirect X-ray detection. A CsI:Tl crystal plate with needle structure mounted on the largest formatted photodiode array allows the scintillation to propagate through the fiberlike-crystals. This structure offers advantages in light propagation over other scintillators of compound. Scintillator thickness has been optimized according to the application.

Assembly Technology

Assembling and packaging of flat panel sensor is of critical importance. It is considerably more challenging than for integrated circuits since flat panel sensors must interact with X-ray irradiation and other harsh environments in higher reliability. The latest robotics techniques were utilized to attain precision alignment, higher reliability assembling and stable quality in large size active area ranging from 5 × 5 cm to 12 × 24 cm.

Wire bonding

Sensor board assembly

IC Design Technology

In recent years, large formatted CMOS solid state image sensors of monocrystalline material have become available. These offer many options compared to amorphous Si and conventional imaging devices. We have developed many types of flat panel sensors that show the tremendous potential offered by large size image sensor devices made in a 0.6 m standard CMOS process. These devices have an anti-blooming (overflow drain), a correlated double sampling (CDS) circuit, external frame start and binning functions.

CAD image of circuit design

CAD image of pattern design

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Flat Panel Sensor Catalog